Asia DCM roundup: SP PowerAssets, Stats ChipPac, TUS

Rev Hui

November 17, 2015 10:00 AM

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Asia’s debt market saw a busy Tuesday with a trio of issuers, SP PowerAssets, Stats ChipPac and TUS Holdings, venturing out for dollars.

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Topics

Deutsche Bank China Barclays Corporate Bonds ING High yield Asia Morgan Stanley Shanghai Pudong Development Bank BNP Paribas News content Singapore Loans and High Yield LevFin High Yield Bonds LevFin Emerging Markets DBS High grade and crossover bonds

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Rev Hui